Texas Instruments Unveils Industry's First 90nm Single-Chip Bluetooth(R) Wireless Networking Solution for 2.5G and 3G Mobile Phones
New BRF6300 Offers Enhanced Data Rate, Lowest Power and Lowest Cost
DALLAS, Nov. 9 /PRNewswire/ -- Texas Instruments Incorporated (NYSE: TXN) (TI) today introduced the industry's first single-chip Bluetooth wireless networking solution using advanced 90 nanometer (nm) process technology. Through use of TI's 90nm process and Digital RF Processor (DRP) technology, TI is delivering the industry's best Bluetooth performance, lowest power and lowest cost for 2G, 2.5G and 3G mobile phone manufacturers in a single chip. The BRF6300 extends TI's leadership in providing wireless solutions in 90nm and is the third single-chip Bluetooth solution using TI's DRP technology. To date TI has shipped over two million units using 90nm process technology for several wireless and DSP products. (See: http://www.ti.com/brf6300 .)
TI's BRF6300 single-chip solution supports the new Bluetooth specification v2.0 and enhanced data rate (EDR). TI delivers full EDR to deliver speeds up to 3Mbps in a Bluetooth network which is up to three times faster than previously possible. This level of bandwidth will support more intensive applications on 2.5G and 3G mobile phones such as video streaming and gaming, as well as faster downloads, e-mailing and more. The single chip also offers scalability for manufacturers since it will be software upgradeable to future Bluetooth enhancements.
The Benefits of TI's DRP and 90nm
TI's DRP technology and 90nm process enable the BRF6300 to integrate more onto a single-chip with lower system costs and power. The BRF6300 provides a 30 percent die size reduction over current solutions, greatly reducing the chip's cost. Through its advance process technology, TI is able to deliver maximum battery efficiency and to provide the lowest cost solution through a reduced bill of materials (BOM), and through integration of all but six external components for the complete Bluetooth system onto the single chip. The BRF6300 offers the industry's lowest power consumption, 100uA, during critical in-use Bluetooth scenarios such as page and inquiry scan, which is three times lower than current solutions. The single chip also offers power reduction during voice connection.
"Bluetooth wireless connectivity continues to see significant growth opportunities, especially within the mobile phone market," said Marc Cetto, general manager of TI's Mobile Connectivity Solutions business unit. "Recognizing this, TI has developed the BRF6300, the wireless industry's first Bluetooth single-chip in 90nm. Reflective of TI's historically innovative approach and experience in Bluetooth solutions, the BRF6300 will deliver low power, small size, low BOM and system optimization, allowing handset manufacturers to quickly deploy Bluetooth technology in mainstream mobile phone models."
Leveraging TI's Wireless Expertise
The BRF6300 leverages TI's expertise in wireless and mobile connectivity solutions including mobile Wi-Fi(R). As a result, the BRF6300 offers improved coexistence and interoperability with WLAN. The BRF6300 supports a shared antenna architecture and coexistence mechanism when used with TI's mobile WLAN chipsets. This level of coexistence enables the delivery data as well as Bluetooth voice and Voice over IP over WLAN in co-located environments like mobile phones.
The BRF6300 is optimized to work with TI's OMAP(TM) processors and wireless terminal chipsets. It is also integrated into several complete reference designs with TI's OMAP processors and GSM/GPRS/WCDMA TCS cellular chipsets.
Availability
The BRF6300 is expected to sample in Q2 2005 with full production expected in Q4 2005. For more information on TI's Bluetooth wireless technology solutions please visit: http://www.ti.com/bluetooth
Texas Instruments - Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth, digital TV and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit http://www.ti.com/wirelesspressroom for additional information.
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com/ .
Trademarks
The Bluetooth(R) word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Texas Instruments is under license.
Wi-Fi is a registered trademark of the Wi-Fi Alliance.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
CONTACT: Marisa Speziale of Texas Instruments Incorporated,
+1-214-480-1795, or m-speziale@ti.com ; or Jennifer Anderson, +1-972-308-9124,
or janderson@golinharris.com , for Texas Instruments Incorporated. Please do
not publish these numbers or e-mail addresses.
Web site: http://www.ti.com/
http://www.ti.com/wirelesspressroom
http://www.ti.com/brf6300
http://www.ti.com/bluetooth
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